Finger Reeds - Suitable For Low Compression Forces And Height Narrow Environments

The production of edge finger reed series, all made of beryllium copper, mechanical and electrical properties are very good, high tensile strength, excellent electrical conductivity, suitable for a wide temperature range. The surface of the reed can also be treated with various electroplating processes according to the needs, such as galvanized chromate, bright nickel, bright tin, etc., to meet the plating compatibility needs of customers. Standard edge finger reed products, applicable to the thickness of the snap-mounted panel is 0.762~2.286mm. In addition, this series of products is available in a variety of structural deformation types, such as T-shaped contacts, D-shaped contacts, reverse snap-in and so on. Therefore, in addition to the standard structure, there are many deformed structure products in this series, and the following introduces several commonly used deformed edge finger reed series.
• Thin edge finger reeds reduce the height of the arc contact surface, making them suitable for low compressive stress and height narrow applications.
• Reverse edge finger reed, the snap structure is folded in reverse, which can save lateral space and increase the width of the card, suitable for use in applications with extremely narrow mounting panels.
• Improved edge finger reed, mainly used in applications where the mounting panel and the mating surface are misaligned, the arc mating surface extends a certain distance from the mounting end, and can complete the contact installation with the farther mating surface.